23-60FS-BD-24-NTP
- Herst.Teilenummer
- 23-60FS-BD-24-NTP
- Hersteller
- Leader Tech Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- 0.23 X 0.60 BD 24 NTP--FOLDED SE
* Menge
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- Hersteller :
- Leader Tech Inc.
- Produktkategorie :
- RFI und EMI – Kontakte, Fingerstock und Dichtungen
- Attachment Method :
- Adhesive
- Material :
- Beryllium Copper
- Operating Temperature :
- -55°C ~ 121°C
- Part Status :
- Active
- Plating :
- Unplated
- Plating - Thickness :
- -
- Shape :
- -
- Type :
- Fingerstock
- Datenblätter
- 23-60FS-BD-24-NTP
Herstellerbezogene Produkte
Katalogbezogene Produkte
Verwandte Produkte
| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| 23-6040-0018 | Kester | 50,000 | SOLDER RA FLUX 22AWG 60/40 .5LB |
| 23-6040-0027 | Kester | 50,000 | SOLDER RA FLUX 20AWG 60/40 .5LB |
| 23-60FS-BD-24 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 BD 24--FOLDED SERIES |
| 23-60FS-BD-3.0 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 BD 3--FOLDED SERIES |
| 23-60FS-BD-400 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 BD 400--FOLDED SERIE |
| 23-60FS-MAG-24 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 MAG 24--FOLDED SERIE |
| 23-60FS-NI-24 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 NI 24--FOLDED SERIES |
| 23-60FS-SN-16 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 SN 16--FOLDED SERIES |
| 23-60FS-SN-24 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 SN 24--FOLDED SERIES |
| 23-60FS-SNPB-24 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 SNPB 24--FOLDED SERI |
| 23-60FSV50-BD-24 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 BD 24--FOLDED SERIES |
| 23-60FSV50-SN-24 | Leader Tech Inc. | 50,000 | 0.23 X 0.60 SN 24--FOLDED SERIES |
| 23-6337-0007 | Kester | 50,000 | SOLDER RA FLUX 27AWG 63/37 .5LB |
| 23-6337-0018 | Kester | 50,000 | SOLDER RA FLUX 22AWG 63/37 .5LB |
| 23-6337-0027 | Kester | 50,000 | SOLDER RA FLUX 20AWG 63/37 .5LB |