96-6337-9531

Herst.Teilenummer
96-6337-9531
Hersteller
Kester
Paket/Fall
-
Datenblatt
Download
Beschreibung
SN63PB37 3.3%/268 .031 500 G
* Menge

Fordern Sie ein Angebot an (RFQ)

* Kontaktname:
* Gesellschaft:
* Email:
* Telefon:
* Kommentar:
* Captcha:
loading...
Hersteller :
Kester
Produktkategorie :
Lot
Composition :
Sn63Pb37 (63/37)
Flux Type :
No-Clean
Form :
Spool, 17.64 oz (500g)
Melting Point :
361°F (183°C)
Mesh Type :
-
Part Status :
Active
Process :
Leaded
Shelf Life :
-
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
50°F ~ 104°F (10°C ~ 40°C)
Type :
Wire Solder
Wire Gauge :
20 AWG, 22 AWG
Datenblätter
96-6337-9531

Herstellerbezogene Produkte

Katalogbezogene Produkte

  • Chip Quik, Inc.
    THERMALLY STABLE SOLDER PASTE NO
  • Kester
    SOLDER FLUX-CORED/285 .031" 1LB
  • Chip Quik, Inc.
    SOLDER PASTE SN63/PB37 250G T5
  • Henkel/Loctite
    97SC C511 2% .064DIA 14AWG
  • Henkel/Loctite
    97SC 400 2% .064DIA 14AWG

Verwandte Produkte

Teil Hersteller Aktie Beschreibung
96-6040-8832 Kester 50,000 SOLDER FLUX-CORED/245 .031" 500
96-6337-8846 Kester 50,000 SOLDER FLUX-CORED/245 63/37 .024
96-6337-9515 Kester 50,000 SN63PB37 3.3%/268 .015 500 G