TS991SNL35T4
- Herst.Teilenummer
- TS991SNL35T4
- Hersteller
- Chip Quik, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- THERMALLY STABLE SOLDER PASTE NC
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- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Lot
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Syringe, 1.23 oz (34.869g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- -
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datenblätter
- TS991SNL35T4
Herstellerbezogene Produkte
Katalogbezogene Produkte
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| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| TS991AX35T4 | Chip Quik, Inc. | 50,000 | THERMALLY STABLE SOLDER PASTE NC |
| TS991AX500T4 | Chip Quik, Inc. | 50,000 | SOLDER PASTE THERMALLY STABLE NC |
| TS991SNL35T3 | Chip Quik, Inc. | 50,000 | THERMALLY STABLE SOLDER PASTE NC |
| TS991SNL500T3 | Chip Quik, Inc. | 50,000 | SOLDER PASTE THERMALLY STABLE NC |
| TS991SNL500T4 | Chip Quik, Inc. | 50,000 | SOLDER PASTE THERMALLY STABLE NC |