BARSN62PB36AG2

Herst.Teilenummer
BARSN62PB36AG2
Hersteller
Chip Quik, Inc.
Paket/Fall
-
Datenblatt
Download
Beschreibung
SOLDER BAR SN62/PB36/AG2 1LB SUP
* Menge

Fordern Sie ein Angebot an (RFQ)

* Kontaktname:
* Gesellschaft:
* Email:
* Telefon:
* Kommentar:
* Captcha:
loading...
Hersteller :
Chip Quik, Inc.
Produktkategorie :
Lot
Composition :
Sn62Pb36Ag2 (62/36/2)
Diameter :
-
Flux Type :
-
Form :
Bar, 1 lb (454g)
Melting Point :
354°F (179°C)
Mesh Type :
-
Part Status :
Active
Process :
Leaded
Shelf Life :
-
Shelf Life Start :
-
Storage/Refrigeration Temperature :
-
Type :
Bar Solder
Wire Gauge :
-
Datenblätter
BARSN62PB36AG2

Herstellerbezogene Produkte

Katalogbezogene Produkte

  • Chip Quik, Inc.
    THERMALLY STABLE SOLDER PASTE NO
  • Kester
    SOLDER FLUX-CORED/285 .031" 1LB
  • Chip Quik, Inc.
    SOLDER PASTE SN63/PB37 250G T5
  • Henkel/Loctite
    97SC C511 2% .064DIA 14AWG
  • Henkel/Loctite
    97SC 400 2% .064DIA 14AWG

Verwandte Produkte

Teil Hersteller Aktie Beschreibung
BARSN42BI57AG1 Chip Quik, Inc. 50,000 SOLDER BAR SN42/BI57/AG1 1LB SUP
BARSN42BI57AG1-8OZ Chip Quik, Inc. 50,000 SOLDER BAR SN42/BI57/AG1 8OZ 227
BARSN60PB40 Chip Quik, Inc. 50,000 SOLDER BAR SN60/PB40 1LB SUPER L
BARSN60PB40-8OZ Chip Quik, Inc. 50,000 SOLDER BAR SN60/PB40 8OZ 227G SU
BARSN62PB36AG2-8OZ Chip Quik, Inc. 50,000 SOLDER BAR SN62/PB36/AG2 8OZ 227
BARSN63PB37 Chip Quik, Inc. 50,000 SOLDER BAR SN63/PB37 1LB SUPER L
BARSN63PB37-8OZ Chip Quik, Inc. 50,000 SOLDER BAR SN63/PB37 8OZ 227G SU
BARSN96.5AG3.0CU0.5 Chip Quik, Inc. 50,000 SOLDER BAR SN96.5/AG3.0/CU0.5 1L
BARSN96.5AG3.0CU0.5-8OZ Chip Quik, Inc. 50,000 SOLDER BAR SN96.5/AG3.0/CU0.5 8O
BARSN99.3CU0.7 Chip Quik, Inc. 50,000 SOLDER BAR SN99.3/CU0.7 1LB SUPE
BARSN99.3CU0.7-8OZ Chip Quik, Inc. 50,000 SOLDER BAR SN99.3/CU0.7 8OZ 227G