NCSWLF.020 1LB
- Herst.Teilenummer
- NCSWLF.020 1LB
- Hersteller
- Chip Quik, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- LF SOLDER WIRE 96.5/3/0.5 TIN/SI
* Menge
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- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Lot
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Flux Type :
- No-Clean
- Form :
- Spool, 1 lb (454 g)
- Melting Point :
- 422 ~ 428°F (217 ~ 220°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- -
- Shelf Life Start :
- -
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- 24 AWG, 25 SWG
- Datenblätter
- NCSWLF.020 1LB
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| NCSW.020 0.3OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE MINI POCKET PACK 63/ |
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| NCSW.031 0.5OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE MINI POCKET PACK 63/ |
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| NCSWLF.015 1LB | Chip Quik, Inc. | 50,000 | LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
| NCSWLF.015 1OZ | Chip Quik, Inc. | 50,000 | LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
| NCSWLF.015 2OZ | Chip Quik, Inc. | 50,000 | LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
| NCSWLF.015 4OZ | Chip Quik, Inc. | 50,000 | LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
| NCSWLF.015 8OZ | Chip Quik, Inc. | 50,000 | LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
| NCSWLF.020 0.3OZ | Chip Quik, Inc. | 50,000 | LF SOLDER WIRE MINI POCKET PACK |
| NCSWLF.031 0.5OZ | Chip Quik, Inc. | 50,000 | LF SOLDER WIRE MINI POCKET PACK |
| NCSWLF.031 1LB | Chip Quik, Inc. | 50,000 | LF SOLDER WIRE 96.5/3/0.5 TIN/SI |