NC191AX50
- Herst.Teilenummer
- NC191AX50
- Hersteller
- Chip Quik, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- SMOOTH FLOW LEADED SOLDER PASTE
* Menge
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- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Lot
- Composition :
- Sn63Pb37 (63/37)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 1.76 oz (50g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Leaded
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 46°F (3°C ~ 8°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datenblätter
- NC191AX50
Herstellerbezogene Produkte
Katalogbezogene Produkte
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| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| NC191 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW TACK FLUX NO-CLEAN I |
| NC191-2CC6 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW TACK FLUX NO-CLEAN I |
| NC191-30CC | Chip Quik, Inc. | 50,000 | SMOOTH FLOW TACK FLUX NO-CLEAN I |
| NC191AX15 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191AX15T5 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191AX250 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191AX250T5 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191AX35 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191AX35T5 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191AX500C | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191AX500T5C | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191AX50T5 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LEADED SOLDER PASTE |
| NC191LT10 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LOW TEMP SOLDER PAST |
| NC191LT15 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LOW TEMP SOLDER PAST |
| NC191LT15T5 | Chip Quik, Inc. | 50,000 | SMOOTH FLOW LOW TEMP SOLDER PAST |