SMDSW.031 1LB
- Herst.Teilenummer
- SMDSW.031 1LB
- Hersteller
- Chip Quik, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- SOLDER WIRE 63/37 TIN/LEAD NO-CL
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- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Lot
- Composition :
- Sn63Pb37 (63/37)
- Flux Type :
- No-Clean, Water Soluble
- Form :
- Spool, 1 lb (454 g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Leaded
- Shelf Life :
- -
- Shelf Life Start :
- -
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- 20 AWG, 22 SWG
- Datenblätter
- SMDSW.031 1LB
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| SMDSW.020 2OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE NO-CLEAN 63/37 2OZ. |
| SMDSW.020 4OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE NO-CLEAN 63/37 4OZ. |
| SMDSW.020 8OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.031 .7OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE POCKET PACK 63/37 TI |
| SMDSW.031 1OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE NO-CLEAN 63/37 1OZ. |