WS991AX500T4
- Herst.Teilenummer
- WS991AX500T4
- Hersteller
- Chip Quik, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- SOLDER PASTE THERMALLY STABLE WS
* Menge
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- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Lot
- Composition :
- Sn63Pb37 (63/37)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Leaded
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datenblätter
- WS991AX500T4
Herstellerbezogene Produkte
Katalogbezogene Produkte
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|---|---|---|---|
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| WS991-5M | Chip Quik, Inc. | 50,000 | WATER-SOLUBLE TACK FLUX W/TIPS |
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| WS991LT35T4 | Chip Quik, Inc. | 50,000 | THERMALLY STABLE SOLDER PASTE WS |
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| WS991SNL35T4 | Chip Quik, Inc. | 50,000 | THERMALLY STABLE SOLDER PASTE WS |
| WS991SNL500T4 | Chip Quik, Inc. | 50,000 | SOLDER PASTE THERMALLY STABLE WS |