DILB40P-223TLF
- Herst.Teilenummer
- DILB40P-223TLF
- Hersteller
- Amphenol Communication Solutions
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 40POS TIN
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- Hersteller :
- Amphenol Communication Solutions
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 100.0µin (2.54µm)
- Contact Finish Thickness - Post :
- 100.0µin (2.54µm)
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyamide (PA), Nylon
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 40 (2 x 20)
- Operating Temperature :
- -55°C ~ 105°C
- Part Status :
- Active
- Termination :
- Solder
- Datenblätter
- DILB40P-223TLF
Herstellerbezogene Produkte
Katalogbezogene Produkte
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|---|---|---|---|
| DILB14P-223TLF | Amphenol Communication Solutions | 99,400 | CONN IC DIP SOCKET 14POS TIN |
| DILB16P-223TLF | Amphenol Communication Solutions | 105,850 | CONN IC DIP SOCKET 16POS TIN |
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| DILB18P223TLF | WEC | 50,000 | CONN DIP SOCKET SKT 18 POS |
| DILB20P-223TLF | Amphenol Communication Solutions | 73,800 | CONN IC DIP SOCKET 20POS TIN |
| DILB24P-223TLF | Amphenol Communication Solutions | 81,580 | CONN IC DIP SOCKET 24POS TINLEAD |
| DILB24P-224TLF | Amphenol Communication Solutions | 50,000 | CONN IC DIP SOCKET 24POS TINLEAD |
| DILB28P-223TLF | Amphenol Communication Solutions | 84,830 | CONN IC DIP SOCKET 28POS TIN |
| DILB32P-223TLF | Amphenol Communication Solutions | 12,960 | CONN IC DIP SOCKET 32POS TINLEAD |
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