528-AG11D
- Herst.Teilenummer
- 528-AG11D
- Hersteller
- TE Connectivity AMP Connectors
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 28POS GOLD
* Menge
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- Hersteller :
- TE Connectivity AMP Connectors
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 25.0µin (0.63µm)
- Contact Finish Thickness - Post :
- -
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Closed Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 28 (2 x 14)
- Operating Temperature :
- -55°C ~ 105°C
- Part Status :
- Obsolete
- Termination :
- Solder
- Datenblätter
- 528-AG11D
Herstellerbezogene Produkte
Katalogbezogene Produkte
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| 528-45AB-ME | Wakefield Thermal | 50,000 | HEATSINK DC/DC HALF BRICK VERT |
| 528-45AB-MET725 | Wakefield Thermal | 50,000 | HEATSINK DC/DC HALF BRICK VERT |
| 528-45AB-MS4 | Wakefield Thermal | 50,000 | HEATSINK BXB50,75,100,150.45"VRT |
| 528-45AB-T725 | Wakefield Thermal | 50,000 | HEATSINK DC/DC HALF BRICK VERT |
| 528-AG10D-ES | TE Connectivity AMP Connectors | 50,000 | CONN IC DIP SOCKET 28POS GOLD |
| 528-AG11D-ES | TE Connectivity AMP Connectors | 50,000 | CONN IC DIP SOCKET 28POS GOLD |
| 528-AG11D-ESL | TE Connectivity AMP Connectors | 50,000 | CONN IC DIP SOCKET 28POS GOLD |