BU180Z-178-HT
- Herst.Teilenummer
- BU180Z-178-HT
- Hersteller
- On-Shore Technology, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 18POS GOLD
* Menge
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- Hersteller :
- On-Shore Technology, Inc.
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Copper
- Contact Finish Thickness - Mating :
- 78.7µin (2.00µm)
- Contact Finish Thickness - Post :
- Flash
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Open Frame
- Housing Material :
- Polybutylene Terephthalate (PBT), Glass Filled
- Mounting Type :
- Surface Mount
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Operating Temperature :
- -55°C ~ 125°C
- Part Status :
- Active
- Termination :
- Solder
- Datenblätter
- BU180Z-178-HT
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Katalogbezogene Produkte
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