AR18-HZL/07-TT-R
- Herst.Teilenummer
- AR18-HZL/07-TT-R
- Hersteller
- ASSMANN WSW Components
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 18POS GOLD
* Menge
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- Hersteller :
- ASSMANN WSW Components
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 30.0µin (0.76µm)
- Contact Finish Thickness - Post :
- 200.0µin (5.08µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Open Frame
- Housing Material :
- Thermoplastic, Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Operating Temperature :
- -40°C ~ 105°C
- Part Status :
- Active
- Termination :
- Solder
- Datenblätter
- AR18-HZL/07-TT-R
Herstellerbezogene Produkte
Katalogbezogene Produkte
Verwandte Produkte
| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| AR18-A21E | Broadcom | 50,000 | ROTARY ENCODER OPTICAL PROG |
| AR18-A21S | Broadcom | 50,000 | ROTARY ENCODER OPTICAL PROG |
| AR18-HZL-TT | ASSMANN WSW Components | 50,000 | CONN IC DIP SOCKET 18POS TIN |
| AR18-HZL/07-TT | ASSMANN WSW Components | 50,000 | CONN IC DIP SOCKET 18POS GOLD |
| AR18-HZW/T | ASSMANN WSW Components | 50,000 | CONN IC DIP SOCKET 18POS GOLD |
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| AR181610CHSC | FIBOX Enclosures | 50,000 | BOX PLAS GRY 19.400"L X 17.110"W |
| AR181610CHSCT | FIBOX Enclosures | 50,000 | BOX PLAS GRAY 19.4"L X 17.110"W |
| AR181610CHSS | FIBOX Enclosures | 50,000 | BOX PLAS GRY 19.400"L X 17.110"W |
| AR181610CHSSL | FIBOX Enclosures | 50,000 | BOX PLAS GRY 19.400"L X 17.110"W |
| AR181610CHSSLT | FIBOX Enclosures | 50,000 | BOX PLAS GRAY 19.4"L X 17.110"W |