30-9503-21
- Herst.Teilenummer
- 30-9503-21
- Hersteller
- Aries Electronics, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 30POS GOLD
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- Hersteller :
- Aries Electronics, Inc.
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 10.0µin (0.25µm)
- Contact Finish Thickness - Post :
- 10.0µin (0.25µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Phosphor Bronze
- Features :
- Closed Frame
- Housing Material :
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 30 (2 x 15)
- Operating Temperature :
- -55°C ~ 125°C
- Part Status :
- Active
- Termination :
- Wire Wrap
- Datenblätter
- 30-9503-21
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|---|---|---|---|
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| 30-9312-1R | WEC | 50,000 | PHONE TWISTFREE CORD DE-TANGLER |
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| 30-9502-1R | WEC | 15,060 | 15 MOD/MOD WHITE STRAIGHT |
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| 30-9503-20 | Aries Electronics, Inc. | 50,000 | CONN IC DIP SOCKET 30POS GOLD |
| 30-9503-30 | Aries Electronics, Inc. | 50,000 | CONN IC DIP SOCKET 30POS GOLD |
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