C8140-04
- Herst.Teilenummer
- C8140-04
- Hersteller
- Aries Electronics, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 40POS TIN
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- Hersteller :
- Aries Electronics, Inc.
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 200.0µin (5.08µm)
- Contact Finish Thickness - Post :
- 200.0µin (5.08µm)
- Contact Material - Mating :
- Phosphor Bronze
- Contact Material - Post :
- Phosphor Bronze
- Features :
- Closed Frame
- Housing Material :
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 40 (2 x 20)
- Operating Temperature :
- -55°C ~ 105°C
- Part Status :
- Obsolete
- Termination :
- Wire Wrap
- Datenblätter
- C8140-04
Herstellerbezogene Produkte
Katalogbezogene Produkte
Verwandte Produkte
| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| C8140 | Sumida Corporation | 50,000 | VOIP FLYBACK XFORMER |
