532-AG11D-ESL
- Herst.Teilenummer
- 532-AG11D-ESL
- Hersteller
- TE Connectivity AMP Connectors
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 32POS GOLD
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- Hersteller :
- TE Connectivity AMP Connectors
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 5.00µin (0.127µm)
- Contact Finish Thickness - Post :
- -
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Closed Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 32 (2 x 16)
- Operating Temperature :
- -55°C ~ 125°C
- Part Status :
- Obsolete
- Termination :
- Solder
- Datenblätter
- 532-AG11D-ESL
Herstellerbezogene Produkte
Katalogbezogene Produkte
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| 532-AG10D | TE Connectivity AMP Connectors | 50,000 | CONN IC DIP SOCKET 32POS GOLD |
| 532-AG11D-ES | TE Connectivity AMP Connectors | 50,000 | CONN IC DIP SOCKET 32POS GOLD |