MS05

Herst.Teilenummer
MS05
Hersteller
Apex Microtechnology
Paket/Fall
-
Datenblatt
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Beschreibung
CONN IC DIP SOCKET 12POS GOLD
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Hersteller :
Apex Microtechnology
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polyester, Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
12 (2 x 6)
Operating Temperature :
-
Part Status :
Discontinued at Digi-Key
Termination :
Solder
Datenblätter
MS05

Herstellerbezogene Produkte

  • Apex Microtechnology
    CONN SOCKET SIP 20POS GOLD
  • Apex Microtechnology
    CONN TRANSIST TO-3 8POS GOLD
  • Apex Microtechnology
    CONN PIN RCPT .032-.046 8/PK
  • Apex Microtechnology
    CONN PIN RCPT .048-.064 12/PK
  • Apex Microtechnology
    CONN PIN RCPT .025-.037 30/STRIP

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