- Hersteller :
- Mill-Max
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 30.0µin (0.76µm)
- Contact Finish Thickness - Post :
- 10.0µin (0.25µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass Alloy
- Features :
- Carrier, Open Frame
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 65 (10 x 10)
- Operating Temperature :
- -55°C ~ 125°C
- Part Status :
- Active
- Termination :
- Solder
- Type :
- PGA
- Datenblätter
- 614-13-065-10-051012
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