DS70830AN80BGV

Herst.Teilenummer
DS70830AN80BGV
Hersteller
Renesas Electronics Corporation
Paket/Fall
-
Datenblatt
Download
Beschreibung
IC DS70830AN80BGV
* Menge

Fordern Sie ein Angebot an (RFQ)

* Kontaktname:
* Gesellschaft:
* Email:
* Telefon:
* Kommentar:
* Captcha:
loading...
Hersteller :
Renesas Electronics Corporation
Produktkategorie :
Eingebettet - Mikrocontroller
Connectivity :
EBI/EMI, FIFO, I²C, SCI, SSU, UART/USART
Core Processor :
SH-2
Core Size :
32-Bit
Data Converters :
A/D 8x10b SAR
EEPROM Size :
-
Mounting Type :
Surface Mount
Number of I/O :
65
Operating Temperature :
-20°C ~ 85°C (TA)
Oscillator Type :
Internal
Package / Case :
112-LFBGA
Part Status :
Last Time Buy
Peripherals :
DMA, POR, PWM, WDT
Program Memory Size :
-
Program Memory Type :
ROMless
RAM Size :
16K x 8
Speed :
80MHz
Supplier Device Package :
112-LFBGA (10x10)
Voltage - Supply (Vcc/Vdd) :
3V ~ 5.5V
Datenblätter
DS70830AN80BGV

Herstellerbezogene Produkte

Katalogbezogene Produkte

Verwandte Produkte

Teil Hersteller Aktie Beschreibung
DS70830AD80BGV Renesas Electronics Corporation 50,000 IC MCU 32BIT 112LFBGA
DS70830AD80FTV Renesas Electronics Corporation 50,000 IC MCU 32BIT CORE SMD
DS70830AN80FTV Renesas Electronics Corporation 50,000 IC MCU 32BIT ROMLESS 100TQFP
DS70850AD80FPV Renesas Electronics Corporation 50,000 IC MCU 32BIT ROMLESS 144LFQFP