LE57D122BTC

Herst.Teilenummer
LE57D122BTC
Hersteller
Microchip Technology
Paket/Fall
-
Datenblatt
Download
Beschreibung
IC TELECOM INTERFACE 44TQFP
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Hersteller :
Microchip Technology
Produktkategorie :
Schnittstelle - Telekom
Current - Supply :
-
Function :
Subscriber Line Interface Concept (SLIC)
Interface :
2-Wire
Mounting Type :
Surface Mount
Number of Circuits :
2
Operating Temperature :
-40°C ~ 85°C
Package / Case :
44-TQFP Exposed Pad
Part Status :
Active
Power (Watts) :
-
Supplier Device Package :
44-TQFP-EP (10x10)
Voltage - Supply :
4.75V ~ 5.25V
Datenblätter
LE57D122BTC

Herstellerbezogene Produkte

Katalogbezogene Produkte

  • Rochester Electronics
    TELECOM CIRCUIT, 1-FUNC, BICMOS,
  • Rochester Electronics
    SLIC
  • Rochester Electronics
    RINGING SLIC FOR ISDN MODEM
  • Rochester Electronics
    SLIC, 2-4 CONVERSION, BIPOLAR,
  • Rochester Electronics
    DUSLIC DUAL CHANNEL SUBSCRIBER L

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