TC1-20G
- Herst.Teilenummer
- TC1-20G
- Hersteller
- Chip Quik, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- HEAT SINK COMPOUND - HIGH DENSIT
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- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Thermisch - Klebstoffe, Epoxide, Fette, Pasten
- Color :
- White
- Features :
- -
- Part Status :
- Active
- Shelf Life :
- 60 Months
- Size / Dimension :
- 20 gram Syringe
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Thermal Conductivity :
- 0.67W/m-K
- Type :
- Silicone Compound
- Usable Temperature Range :
- -
- Datenblätter
- TC1-20G
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