APF30-30-06CB
- Herst.Teilenummer
- APF30-30-06CB
- Hersteller
- CTS Corporation
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- HEATSINK LOW-PROFILE FORGED
* Menge
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- Hersteller :
- CTS Corporation
- Produktkategorie :
- Thermal - Kühlkörper
- Attachment Method :
- Thermal Tape, Adhesive (Not Included)
- Diameter :
- -
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- -
- Shape :
- Square, Fins
- Thermal Resistance @ Forced Air Flow :
- 4.40°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Top Mount
- Datenblätter
- APF30-30-06CB
Herstellerbezogene Produkte
Katalogbezogene Produkte
Verwandte Produkte
| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| APF30-30-06CB/A01 | CTS Corporation | 50,000 | HEATSINK FORGED W/ADHESIVE TAPE |
| APF30-30-10CB | CTS Corporation | 50,000 | HEATSINK LOW-PROFILE FORGED |
| APF30-30-13CB | CTS Corporation | 10,610 | HEATSINK LOW-PROFILE FORGED |
| APF30-30-13CB/A01 | CTS Corporation | 35,960 | HEATSINK FORGED W/ADHESIVE TAPE |
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