DB- SMART-AUDIO-APQ8009-0-A

Herst.Teilenummer
DB- SMART-AUDIO-APQ8009-0-A
Hersteller
Qualcomm
Paket/Fall
-
Datenblatt
Download
Beschreibung
AUDIO DEV KIT W/O ACOUSTICS
* Menge

Fordern Sie ein Angebot an (RFQ)

* Kontaktname:
* Gesellschaft:
* Email:
* Telefon:
* Kommentar:
* Captcha:
loading...
Hersteller :
Qualcomm
Produktkategorie :
HF-Evaluierungs- und Entwicklungskits, Boards
For Use With/Related Products :
APQ8009
Frequency :
2.4GHz, 5GHz
Part Status :
Active
Supplied Contents :
Board(s), Cable(s), Power Supply, Accessories
Type :
Transceiver; 802.11 a/b/g/n/ac (Wi-Fi, WiFi, WLAN), Bluetooth® Smart Ready 4.x Dual Mode

Herstellerbezogene Produkte

Katalogbezogene Produkte

Verwandte Produkte

Teil Hersteller Aktie Beschreibung
DB-10 Amphenol Industrial 50,000 CABLE GRIP 12.7-15.9MM ALUMINUM
DB-1045 Amphenol Industrial 50,000 CABLE GRIP 12.7-15.9MM MET ALLOY
DB-1090 Amphenol Industrial 50,000 CABLE GRIP RA 12.7-15.9MM METAL
DB-14 Amphenol Industrial 50,000 CABLE GRIP 22.2-25.4MM ALUMINUM
DB-16 Rochester Electronics 50,000 16-CHNL. SLD. STATE PANEL
DB-183188-60/120 Narda-MITEQ 50,000 HIGH PERFORMANCE KA-BAND LOW NOI
DB-197207-60/120 Narda-MITEQ 50,000 HIGH PERFORMANCE KA-BAND LOW NOI
DB-197207-60/120-1 Narda-MITEQ 50,000 HIGH PERFORMANCE KA-BAND LOW NOI
DB-19977-2 Cinch Connectivity Solutions 50,000 CONN BACKSHELL 25POS 90DEG
DB-2-63 WEC 50,000 DB-2-63
DB-202212-60/120 Narda-MITEQ 50,000 HIGH PERFORMANCE KA-BAND LOW NOI
DB-202212-60/120-1 Narda-MITEQ 50,000 HIGH PERFORMANCE KA-BAND LOW NOI
DB-20962 WEC 50,000 CONN BACKSHELL 25POS 180DEG
DB-24 Rochester Electronics 50,000 MODULE 24CHAN DIGITAL I/O RELAY
DB-24659-32 Cinch Connectivity Solutions 50,000 CONN BACKSHELL 25POS 180DEG