WS991LT35T4
- Herst.Teilenummer
- WS991LT35T4
- Hersteller
- Chip Quik, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- THERMALLY STABLE SOLDER PASTE WS
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- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Lot
- Composition :
- Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Syringe, 1.23 oz (34.869g)
- Melting Point :
- 280°F (138°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- -
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datenblätter
- WS991LT35T4
Herstellerbezogene Produkte
Katalogbezogene Produkte
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| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| WS991 | Chip Quik, Inc. | 50,000 | TACKY FLUX WATER-SOLUBLE 10CC SY |
| WS991-10M | Chip Quik, Inc. | 50,000 | WATER-SOLUBLE FLUX W/TIPS |
| WS991-5M | Chip Quik, Inc. | 50,000 | WATER-SOLUBLE TACK FLUX W/TIPS |
| WS991AX35T4 | Chip Quik, Inc. | 50,000 | THERMALLY STABLE SOLDER PASTE WS |
| WS991AX500T4 | Chip Quik, Inc. | 50,000 | SOLDER PASTE THERMALLY STABLE WS |
| WS991LT500T4 | Chip Quik, Inc. | 50,000 | SOLDER PASTE THERMALLY STABLE WS |
| WS991SNL35T4 | Chip Quik, Inc. | 50,000 | THERMALLY STABLE SOLDER PASTE WS |
| WS991SNL500T4 | Chip Quik, Inc. | 50,000 | SOLDER PASTE THERMALLY STABLE WS |