HS03

Herst.Teilenummer
HS03
Hersteller
Apex Microtechnology
Paket/Fall
-
Datenblatt
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Beschreibung
HEATSINK 8P TO-3 1.7C/W
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Hersteller :
Apex Microtechnology
Produktkategorie :
Thermal - Kühlkörper
Attachment Method :
Bolt On
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
TO-3
Part Status :
Discontinued at Digi-Key
Power Dissipation @ Temperature Rise :
15.0W @ 30°C
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
1.00°C/W @ 200 LFM
Thermal Resistance @ Natural :
1.70°C/W
Type :
Board Level
Datenblätter
HS03

Herstellerbezogene Produkte

  • Apex Microtechnology
    CONN SOCKET SIP 20POS GOLD
  • Apex Microtechnology
    CONN TRANSIST TO-3 8POS GOLD
  • Apex Microtechnology
    CONN IC DIP SOCKET 12POS GOLD
  • Apex Microtechnology
    CONN PIN RCPT .032-.046 8/PK
  • Apex Microtechnology
    CONN PIN RCPT .048-.064 12/PK

Katalogbezogene Produkte

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