HS11

Herst.Teilenummer
HS11
Hersteller
Apex Microtechnology
Paket/Fall
-
Datenblatt
Download
Beschreibung
HEATSINK 2TO-3 & 12P DIP H2O
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Hersteller :
Apex Microtechnology
Produktkategorie :
Thermal - Kühlkörper
Attachment Method :
Bolt On
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
TO-3, PDIP
Part Status :
Discontinued at Digi-Key
Power Dissipation @ Temperature Rise :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
0.68°C/W
Type :
Board Level
Datenblätter
HS11

Herstellerbezogene Produkte

  • Apex Microtechnology
    CONN SOCKET SIP 20POS GOLD
  • Apex Microtechnology
    CONN TRANSIST TO-3 8POS GOLD
  • Apex Microtechnology
    CONN IC DIP SOCKET 12POS GOLD
  • Apex Microtechnology
    CONN PIN RCPT .032-.046 8/PK
  • Apex Microtechnology
    CONN PIN RCPT .048-.064 12/PK

Katalogbezogene Produkte

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