TC3-1G
- Herst.Teilenummer
- TC3-1G
- Hersteller
- Chip Quik, Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- HEAT SINK THERMAL COMPOUND
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- Hersteller :
- Chip Quik, Inc.
- Produktkategorie :
- Thermisch - Klebstoffe, Epoxide, Fette, Pasten
- Color :
- Gray
- Features :
- -
- Part Status :
- Active
- Shelf Life :
- 60 Months
- Size / Dimension :
- 1 gram Syringe
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Thermal Conductivity :
- 8.50W/m-K
- Type :
- Silicone Compound
- Usable Temperature Range :
- -40°F ~ 302°F (-40°C ~ 150°C)
- Datenblätter
- TC3-1G
Herstellerbezogene Produkte
Katalogbezogene Produkte
Verwandte Produkte
| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| TC3-10G | Chip Quik, Inc. | 50,000 | HEAT SINK THERMAL COMPOUND |
| TC3-1T+ | Mini-Circuits | 50,000 | 1:3 CORE & WIRE TRANSFORMER, 5 - |
| TC3-1TG2+ | Mini-Circuits | 50,000 | 1:3 CORE & WIRE TRANSFORMER, 5 - |
| TC3-1TX+ | Mini-Circuits | 50,000 | 1:3 CORE & WIRE TRANSFORMER, 5 - |
| TC3-3.5G | Chip Quik, Inc. | 50,000 | HEAT SINK THERMAL COMPOUND |
| TC3-5-C100 | Panduit Corporation | 50,000 | CBL CLIP C-TYPE BLACK FASTENER |