TC3-1T+
- Herst.Teilenummer
- TC3-1T+
- Hersteller
- Mini-Circuits
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- 1:3 CORE & WIRE TRANSFORMER, 5 -
* Menge
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- Hersteller :
- Mini-Circuits
- Produktkategorie :
- Balun
- Frequency Range :
- 5MHz ~ 300MHz
- Impedance - Unbalanced/Balanced :
- 1:3
- Insertion Loss (Max) :
- 1.0dB
- Mounting Type :
- Surface Mount
- Package / Case :
- 5-SMD Module
- Part Status :
- Active
- Phase Difference :
- 5°
- Return Loss (Min) :
- 21.45dB
- Datenblätter
- TC3-1T+
Herstellerbezogene Produkte
Katalogbezogene Produkte
Verwandte Produkte
| Teil | Hersteller | Aktie | Beschreibung |
|---|---|---|---|
| TC3-10G | Chip Quik, Inc. | 50,000 | HEAT SINK THERMAL COMPOUND |
| TC3-1G | Chip Quik, Inc. | 50,000 | HEAT SINK THERMAL COMPOUND |
| TC3-1TG2+ | Mini-Circuits | 50,000 | 1:3 CORE & WIRE TRANSFORMER, 5 - |
| TC3-1TX+ | Mini-Circuits | 50,000 | 1:3 CORE & WIRE TRANSFORMER, 5 - |
| TC3-3.5G | Chip Quik, Inc. | 50,000 | HEAT SINK THERMAL COMPOUND |
| TC3-5-C100 | Panduit Corporation | 50,000 | CBL CLIP C-TYPE BLACK FASTENER |