NCSWLF.020 1LB

N° de pièce du fabricant
NCSWLF.020 1LB
Fabricant
Chip Quik, Inc.
Paquet/Cas
-
Fiche de données
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La description
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
* Quantité

Demander un devis (RFQ)

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Fabricant :
Chip Quik, Inc.
catégorie de produit :
Souder
Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Flux Type :
No-Clean
Form :
Spool, 1 lb (454 g)
Melting Point :
422 ~ 428°F (217 ~ 220°C)
Mesh Type :
-
Part Status :
Active
Process :
Lead Free
Shelf Life :
-
Shelf Life Start :
-
Storage/Refrigeration Temperature :
-
Type :
Wire Solder
Wire Gauge :
24 AWG, 25 SWG
Feuilles de données
NCSWLF.020 1LB

Produits liés au fabricant

Produits liés au catalogue

  • Chip Quik, Inc.
    THERMALLY STABLE SOLDER PASTE NO
  • Kester
    SOLDER FLUX-CORED/285 .031" 1LB
  • Chip Quik, Inc.
    SOLDER PASTE SN63/PB37 250G T5
  • Henkel/Loctite
    97SC C511 2% .064DIA 14AWG
  • Henkel/Loctite
    97SC 400 2% .064DIA 14AWG

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