SMDSW.020 1LB
- N° de pièce du fabricant
- SMDSW.020 1LB
- Fabricant
- Chip Quik, Inc.
- Paquet/Cas
- -
- Fiche de données
- Télécharger
- La description
- SOLDER WIRE 63/37 TIN/LEAD NO-CL
* Quantité
Demander un devis (RFQ)
- * Nom du contact:
- * Compagnie:
- * E-mail:
- * Téléphoner:
- * Commentaire:
- * Captcha:
-
- Fabricant :
- Chip Quik, Inc.
- catégorie de produit :
- Souder
- Composition :
- Sn63Pb37 (63/37)
- Flux Type :
- No-Clean, Water Soluble
- Form :
- Spool, 1 lb (454 g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Leaded
- Shelf Life :
- -
- Shelf Life Start :
- -
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- 24 AWG, 25 SWG
- Feuilles de données
- SMDSW.020 1LB
Produits liés au fabricant
Produits liés au catalogue
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| SMDSW.020 .4OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE POCKET PACK 63/37 TI |
| SMDSW.020 1OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE NO-CLEAN 63/37 1OZ. |
| SMDSW.020 2OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE NO-CLEAN 63/37 2OZ. |
| SMDSW.020 4OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE NO-CLEAN 63/37 4OZ. |
| SMDSW.020 8OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.031 .7OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE POCKET PACK 63/37 TI |
| SMDSW.031 1LB | Chip Quik, Inc. | 50,000 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.031 1OZ | Chip Quik, Inc. | 50,000 | SOLDER WIRE NO-CLEAN 63/37 1OZ. |