SMDLTLFP250T4
- N° de pièce du fabricant
- SMDLTLFP250T4
- Fabricant
- Chip Quik, Inc.
- Paquet/Cas
- -
- Fiche de données
- Télécharger
- La description
- SOLDER PASTE LOW TEMP T4 250G
* Quantité
Demander un devis (RFQ)
- * Nom du contact:
- * Compagnie:
- * E-mail:
- * Téléphoner:
- * Commentaire:
- * Captcha:
-
- Fabricant :
- Chip Quik, Inc.
- catégorie de produit :
- Souder
- Composition :
- Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 8.8 oz (250g)
- Melting Point :
- 281°F (138°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 46°F (3°C ~ 8°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Feuilles de données
- SMDLTLFP250T4
Produits liés au fabricant
Produits liés au catalogue
Produits connexes
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|---|---|---|---|
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