DILB24P-223TLF

N° de pièce du fabricant
DILB24P-223TLF
Fabricant
Amphenol Communication Solutions
Paquet/Cas
-
Fiche de données
Télécharger
La description
CONN IC DIP SOCKET 24POS TINLEAD
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Fabricant :
Amphenol Communication Solutions
catégorie de produit :
Supports pour circuits intégrés, transistors
Contact Finish - Mating :
Tin-Lead
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Mating :
100.0µin (2.54µm)
Contact Finish Thickness - Post :
100.0µin (2.54µm)
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Open Frame
Housing Material :
Polyamide (PA), Nylon
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
24 (2 x 12)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Active
Termination :
Solder
Feuilles de données
DILB24P-223TLF

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Produits liés au catalogue

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