BDN13-3CB/A01
- N° de pièce du fabricant
- BDN13-3CB/A01
- Fabricant
- CTS Corporation
- Paquet/Cas
- -
- Fiche de données
- Télécharger
- La description
- HEATSINK CPU W/ADHESIVE 1.31"SQ
* Quantité
Demander un devis (RFQ)
- * Nom du contact:
- * Compagnie:
- * E-mail:
- * Téléphoner:
- * Commentaire:
- * Captcha:
-
- Fabricant :
- CTS Corporation
- catégorie de produit :
- Thermique - Dissipateurs de chaleur
- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- -
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 6.00°C/W @ 400 LFM
- Thermal Resistance @ Natural :
- 16.10°C/W
- Type :
- Top Mount
- Feuilles de données
- BDN13-3CB/A01
Produits liés au fabricant
Produits liés au catalogue
Produits connexes
| Partie | Fabricant | Stocker | La description |
|---|---|---|---|
| BDN10-3CB/A01 | CTS Corporation | 42,140 | HEATSINK CPU W/ADHESIVE 1.01"SQ |
| BDN10-5CB/A01 | CTS Corporation | 50,000 | HEATSINK CPU W/ADHESIVE 1.01"SQ |
| BDN11-3CB/A01 | CTS Corporation | 49,840 | HEATSINK CPU W/ADHESIVE 1.11"SQ |
| BDN12-3CB/A01 | CTS Corporation | 50,000 | HEATSINK CPU W/ADHESIVE 1.21"SQ |
| BDN12-5CB/A01 | CTS Corporation | 50,000 | HEATSINK CPU W/ADHESIVE 1.21"SQ |
| BDN14-3CB/A01 | CTS Corporation | 50,000 | HEATSINK CPU W/ADHESIVE 1.41"SQ |
| BDN15-3CB/A01 | CTS Corporation | 50,000 | HEATSINK CPU W/ADHESIVE 1.51"SQ |
| BDN16-3CB/A01 | CTS Corporation | 50,000 | HEATSINK CPU W/ADHESIVE 1.61"SQ |
| BDN17-3CB/A01 | CTS Corporation | 50,000 | HEATSINK CPU W/ADHESIVE 1.71"SQ |
| BDN18-3CB/A01 | CTS Corporation | 14,040 | HEATSINK CPU W/ADHESIVE 1.81"SQ |
| BDN18-6CB/A01 | CTS Corporation | 19,610 | HEATSINK CPU W/ADHESIVE 1.81"SQ |