HSS11-B20-P38
- N° de pièce du fabricant
- HSS11-B20-P38
- Fabricant
- CUI Devices
- Paquet/Cas
- -
- Fiche de données
- Télécharger
- La description
- HEAT SINK, STAMPING, TO-220, 50.
* Quantité
Demander un devis (RFQ)
- * Nom du contact:
- * Compagnie:
- * E-mail:
- * Téléphoner:
- * Commentaire:
- * Captcha:
-
- Fabricant :
- CUI Devices
- catégorie de produit :
- Thermique - Dissipateurs de chaleur
- Attachment Method :
- Bolt On and PC Pin
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-220
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 4.8W @ 75°C
- Shape :
- Rectangular
- Thermal Resistance @ Forced Air Flow :
- 6.90°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 15.76°C/W
- Type :
- Board Level, Vertical
- Feuilles de données
- HSS11-B20-P38
Produits liés au fabricant
Produits liés au catalogue
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